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Flexible & Printed Electronics Ecosystem Development

OE-A Roadmap for Flexible and Printed Electronics

Period: 2008–present
Roles: Former OE-A board member, Encapsulation Working Group founder, roadmap contributor/editorial participant, LOPEC moderator and panel chair, IEC TC119 contributor.

This work reflects a long-standing contribution to the flexible and printed electronics ecosystem: not only through technology development, but also through roadmapping, standards, dissemination, conference moderation and industry-community building.

Focus areas

  • Industry roadmapping.
  • International standardization.
  • Technology adoption and ecosystem development.
  • Sustainability, circularity and industrial maturation.
  • Knowledge dissemination and community building.
LOPEC standards panel

Standards

Moderating discussion among IEC, IPC and SEMI representatives on standards for flexible and printed electronics.

LOPEC sustainability panel

Sustainability

Moderating discussion on sustainability, circularity and printed electronics.

Organic and Printed Electronics book cover

Knowledge dissemination

Co-editor of Organic and Printed Electronics, second edition.